September News Letter

The science of Selective Soldering

Later this month we take delivery of a brand new selective soldering machine. The Versaflow 3/45 is manufactured by Kurt Ersa and supplied via Blundell and it really is state of the art technology.
This machine guarantees perfect solder joint definition and reproducibility and will enable us to product IPC Class III solder joints on PCBs of all shapes and sizes.

We have elected to use this machine together with a nitrogen generator and I wanted to share with you the decision for this equipment selection.

As SMT technology grows in popularity, through hole technology is taking up less overall space on the PCB assembly. Through-hole pins are still needed on many PCBs and they still need to be soldered. There is the option to hand solder these pins but this is a slow process and can’t guarantee repeatable accuracy or quality.

This is where selective soldering comes to the fore. The selective soldering process allows us to solder through-hole pins and work around delicate SMT packages by targeting specific areas on the board. This promotes repeatability and fewer defects.

This technology uses a round miniature pumped solder wave, like the end of a pencil to sequentially solder the PCB. The system also deploys a pre-heating process to improve flux activation and migration. It also uses higher than normal solder pot temperatures, which can increase the risk of oxidisation. To alleviate this risk, we have decided to use a class 5 (>99.99%) Nitrogen gas supply, which stops oxidisation and increases the solder spread.

If you want to see a video of this machine in operation click here. We are currently writing a white paper on selective soldering, please click here if you would like a copy when it is available


Michael Keens                                    Solder Paste Printing                Component Placement 

Senior Production Engineer                    White Paper Here                         White Paper Here

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